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4.9-5.8 GHz High-Linearity Power Amplifier
SST11CP15
Data Sheet
PACKAGING DIAGRAMS
TOP VIEW
2.00
0.05
SIDE VIEW
BOTTOM VIEW
See notes
2 and 3
Pin 1
(Laser
0.075
Pin 1
Engraved)
2.00
0.05
0.92
0.4 BSC
0.265
0.165
0.05 Max
0.60
0.50
0.25
0.15
0.34
0.24
1mm
12-uqfn-2x2-QUB-1.0
Note 1. Similar to JEDEC JEP95 UQFN/USON variants, though number of contacts and some dimensions are different.
2. From the bottom view, the pin 1 in dicator may be either a curved indent or a 45-degree chamfer.
3. The external paddle is electrically connected to the die back-side and to V SS .
This paddle must be soldered to the PC board; it is required to connect this paddle to the V SS of the unit.
Connection of this paddle to any other voltage potential will result in shorts and electrical malfunction of
the device.
4. Untoleranced dimensions are nominal target dimensions.
5. All linear dimensions are in millimeters (max/min).
FIGURE 11: 12-contact Ultra-thin Quad Flat No-lead (UQFN)
SST Package Code: QUB
TABLE 4: Revision History
Revision
Description
Date
00
01
?
?
Initial Release of Data Sheet
Updated Features on page 1; Table 2 on page 4; and Figures 3-5, 7,8, and 10.
Jul 2010
Jan 2011
Silicon Storage Technology, Inc.
www.SuperFlash.com or www.sst.com
?2011 Silicon Storage Technology, Inc.
11
S71428-01-000
01/11
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